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solder replacement adhesives

In70-Pb30 Indium-Lead Solder
Categories: Metal; Nonferrous Metal; Indium Alloy; Solder/Braze Alloy

Material Notes: Characteristics:
  • Low Melt Temperature
  • Improved thermal fatigue properties when compared with Pb-Sn solders
  • Reduced gold scavenging
  • Wide temperature range allows for two- or three-step soldering

Applications:

  • General soldering
  • Microwire
  • Microcream

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Physical PropertiesMetricEnglishComments
Specific Gravity 8.52 g/cc8.52 g/ccCalculated
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 23.8 MPa3450 psi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000200 ohm-cm0.0000200 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 38.0 W/m-K
@Temperature 85.0 °C
264 BTU-in/hr-ft²-°F
@Temperature 185 °F
Melting Point 160 - 174 °C320 - 345 °F
Solidus 160 °C320 °F
Liquidus 174 °C345 °F
 
Component Elements PropertiesMetricEnglishComments
Indium, In 70 %70 %
Lead, Pb 30 %30 %
 
Descriptive Properties
ASTM B774(a) Alloy Designation320-345

References for this datasheet.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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MLIND906 / 135520

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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