CEN® Electronic Material BL Polyimide Film

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CEN® Electronic Material BL Polyimide Film
Categories:	Polymer; Film; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	CEN®BL polyimide film is a printable film that has the same thermal and chemical properties as CEN®CN Polyimide Film, which offers excellent performance in temperatures from -269-400°C. CEN®BL is pigmented to provide contrast and eliminate the need for opaque coatings. Printing on BL can be accomplished with thermal transfer and laser printing. Applications: Labels for high temperature, cryogenic storage, harsh chemical environments, and printed circuit board identification. All information provided by CEN Electronic Material Co., LTD.
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Physical Properties	Metric	English	Comments

Density	1.42 g/cc	0.0513 lb/in³
Thickness	46.0 - 54.0 microns	1.81 - 2.13 mil	ASTM D374

Mechanical Properties	Metric	English	Comments
Film Tensile Strength at Yield, MD	145 MPa	21000 psi	ASTM D882
Film Tensile Strength at Yield, TD	135 MPa	19600 psi	ASTM D882
Elongation at Yield	>= 45 %	>= 45 %	ASTM D882

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm
Surface Resistivity per Square	>= 1.00e+13 ohm	>= 1.00e+13 ohm	ASTM D257

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PCENE004 / 93466

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