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Master Bond adhesives

LG Chemical HIPS 403AF PS, Flame Retardant  (discontinued **)
Categories: Polymer; Thermoplastic; Polystyrene (PS); Polystyrene, Flame Retardant

Material Notes: Description: Injection Molding, PS, Flame Retardant

Application: Electric Parts Requiring Flame Retardancy

CAS: 9003-55-8, 21850-44-2 and 1309-64-4

Information provided by LG Chemical

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.06 g/cc1.06 g/ccASTM D792
Maximum Moisture Content 0.0100.010Injection Molding
Linear Mold Shrinkage, Flow 0.0040 - 0.0080 cm/cm
@Thickness 3.20 mm
0.0040 - 0.0080 in/in
@Thickness 0.126 in
ASTM D955
Melt Flow 11 g/10 min
@Load 5.00 kg,
Temperature 200 °C
11 g/10 min
@Load 11.0 lb,
Temperature 392 °F
ASTM D1238
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell R 9797ASTM D785
Tensile Strength, Yield 24.5 MPa
@Thickness 3.20 mm
3560 psi
@Thickness 0.126 in
50mm/min; ASTM D638
Elongation at Break 60 %
@Thickness 3.20 mm
60 %
@Thickness 0.126 in
50mm/min; ASTM D638
Elongation at Yield >= 5.0 %
@Thickness 3.20 mm
>= 5.0 %
@Thickness 0.126 in
50mm/min; ASTM D638
Flexural Yield Strength 41.2 MPa
@Thickness 3.20 mm
5970 psi
@Thickness 0.126 in
15mm/min; ASTM D790
Flexural Modulus 2.26 GPa
@Thickness 3.20 mm
327 ksi
@Thickness 0.126 in
15mm/min; ASTM D790
Izod Impact, Notched  0.392 J/cm
@Thickness 6.40 mm,
Temperature -30.0 °C
0.735 ft-lb/in
@Thickness 0.252 in,
Temperature -22.0 °F
ASTM D256
 0.490 J/cm
@Thickness 3.20 mm,
Temperature -30.0 °C
0.918 ft-lb/in
@Thickness 0.126 in,
Temperature -22.0 °F
ASTM D256
 0.883 J/cm
@Thickness 6.40 mm,
Temperature 23.0 °C
1.65 ft-lb/in
@Thickness 0.252 in,
Temperature 73.4 °F
ASTM D256
 1.08 J/cm
@Thickness 3.20 mm,
Temperature 23.0 °C
2.02 ft-lb/in
@Thickness 0.126 in,
Temperature 73.4 °F
ASTM D256
 
Electrical PropertiesMetricEnglishComments
Arc Resistance 120 - 180 sec120 - 180 secASTM D495
Comparative Tracking Index 400 - 600 V400 - 600 V
Hot Wire Ignition, HWI  7.0 - 15 sec
@Thickness >=1.50 mm
7.0 - 15 sec
@Thickness >=0.0591 in
 15 - 30 sec
@Thickness >=3.00 mm
15 - 30 sec
@Thickness >=0.118 in
High Amp Arc Ignition, HAI  >= 120 arcs
@Thickness 1.50 mm
>= 120 arcs
@Thickness 0.0591 in
 >= 120 arcs
@Thickness 3.00 mm
>= 120 arcs
@Thickness 0.118 in
High Voltage Arc-Tracking Rate, HVTR 10.0 - 25.4 mm/min0.394 - 1.00 in/min
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 0.46 MPa (66 psi) 83.0 °C
@Thickness 6.40 mm
181 °F
@Thickness 0.252 in
Unannealed; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 77.0 °C
@Thickness 6.40 mm
171 °F
@Thickness 0.252 in
Unannealed; ASTM D648
Vicat Softening Point 83.0 °C
@Load 5.00 kg
181 °F
@Load 11.0 lb
50°C/h; ASTM D1525
UL RTI, Electrical  50.0 °C
@Thickness >=1.60 mm
122 °F
@Thickness >=0.0630 in
 50.0 °C
@Thickness >=3.00 mm
122 °F
@Thickness >=0.118 in
UL RTI, Mechanical with Impact  50.0 °C
@Thickness >=1.60 mm
122 °F
@Thickness >=0.0630 in
 50.0 °C
@Thickness >=3.00 mm
122 °F
@Thickness >=0.118 in
UL RTI, Mechanical without Impact  50.0 °C
@Thickness >=1.60 mm
122 °F
@Thickness >=0.0630 in
 50.0 °C
@Thickness >=3.00 mm
122 °F
@Thickness >=0.118 in
Flammability, UL94  V-2
@Thickness >=1.60 mm
V-2
@Thickness >=0.0630 in
 V-2
@Thickness >=3.20 mm
V-2
@Thickness >=0.126 in
 
Processing PropertiesMetricEnglishComments
Rear Barrel Temperature 180 - 200 °C356 - 392 °FInjection Molding
Middle Barrel Temperature 190 - 200 °C374 - 392 °FInjection Molding
Front Barrel Temperature 200 - 210 °C392 - 410 °FInjection Molding
Nozzle Temperature 200 - 230 °C392 - 446 °FInjection Molding
Melt Temperature 200 - 230 °C392 - 446 °FInjection Molding
Mold Temperature 40.0 - 60.0 °C104 - 140 °FInjection Molding
Drying Temperature 60.0 - 70.0 °C140 - 158 °FInjection Molding
Dry Time 3.00 - 4.00 hour3.00 - 4.00 hourInjection Molding
Back Pressure 29.4 - 58.8 MPa4260 - 8530 psiInjection Molding
Screw Speed 30 - 60 rpm30 - 60 rpmInjection Molding

**
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