| GeleaseTM MG-122 is a one-component, thermally conductive silicone gel interface material that merges the low thermal resistance properties of a grease with the integrity of a gel. This formulation is a second generation Gelease™ thermal interface material specifically developed for excellent HAST resistance. GeleaseTM MG-122 is designed to provide the most efficient heat transfer from Flip Chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The crosslink structure of this formulation inhibits bleed, separation, and pump-out, which is typically, observed in many thermal interface materials.All information provided by Lord. |
