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Chemically Resistant adhesives

Cosmic Plastics E4940S Mineral Filled Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled

Material Notes: Description: Cosmic E4940S is a mineral filled epoxy molding compound which is supplied in a granular form.

Features: It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance. Standard spiral flow range is 25-35” (EMMI) at 1500C and 1000 psi. It has a hot plate gel time of 22-30 seconds at 1600C, and 18-26 seconds at 1820C. It has a shelf life of eight months when stored at 50C.

Applications: It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.

Information provided by Cosmic Plastics Inc

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.85 g/cc1.85 g/cc
Bulk Factor 2.0 - 5.02.0 - 5.0
Water Absorption 0.25 %
@Temperature 50.0 °C,
Time 173000 sec
0.25 %
@Temperature 122 °F,
Time 48.0 hour
Linear Mold Shrinkage 0.0020 - 0.0040 cm/cm0.0020 - 0.0040 in/in
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6565
Tensile Strength at Break 82.7 MPa12000 psi
Flexural Strength 103 MPa15000 psi
Flexural Modulus 13.8 GPa2000 ksi
Compressive Strength 193 MPa28000 psi
Izod Impact, Notched 0.267 J/cm0.500 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+15 ohm-cm1.00e+15 ohm-cm
Surface Resistance 1.00e+15 ohm1.00e+15 ohm
Dielectric Constant  3.9
@Frequency 1000 Hz
3.9
@Frequency 1000 Hz
Wet
 4.3
@Frequency 1e+6 Hz
4.3
@Frequency 1e+6 Hz
Wet
Dielectric Strength 13.8 kV/mm350 kV/inWet, step by step
Dielectric Breakdown 56 V56 VWet, step by step
Dissipation Factor  0.011
@Frequency 1e+6 Hz
0.011
@Frequency 1e+6 Hz
Wet
 0.012
@Frequency 1000 Hz
0.012
@Frequency 1000 Hz
Wet
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 20.0 µm/m-°C11.1 µin/in-°FAlpha 1
 70.0 µm/m-°C38.9 µin/in-°FAlpha 2
Thermal Conductivity 0.669 W/m-K4.64 BTU-in/hr-ft²-°F
Heat Distortion Temperature 260 °C500 °F
Glass Transition Temp, Tg 175 °C347 °F
Flammability, UL94 V-0
@Thickness 3.17 mm
V-0
@Thickness 0.125 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 150 - 180 °C302 - 356 °F
 
Descriptive Properties
Molding Pressure500-8000 psi

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PCOSM022 / 190804

Chemically Resistant adhesives

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