MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

Sumitomo Bakelite North America E 3812M-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset

Material Notes: E 3812M-1 is a mineral and short fiberglass filled epoxy molding compound for low pressure encapsulation molding, featuring excellent dimensional stability, good thermal shock resistance, and good electrical insulation properties.

Information provided by Sumitomo Bakelite North America, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Bulk Density 0.950 g/cc0.0343 lb/in³ASTM D1895
Density 1.86 g/cc0.0672 lb/in³ASTM D792
Water Absorption 0.30 %
@Temperature 50.0 °C,
Time 173000 sec
0.30 %
@Temperature 122 °F,
Time 48.0 hour
ASTM D570
Linear Mold Shrinkage 0.0035 - 0.0050 cm/cm0.0035 - 0.0050 in/inASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 58.0 MPa8410 psiASTM D638
Flexural Strength 94.0 MPa13600 psiat rupture; ASTM D790
Flexural Modulus 13.0 GPa1890 ksiASTM D790
Compressive Strength 213 MPa30900 psiASTM D695
Izod Impact, Notched 0.160 J/cm0.300 ft-lb/inASTM D256
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1e+6 Hz
3.8
@Frequency 1e+6 Hz
wet; ASTM D150
Dielectric Strength  13.8 kV/mm
@Frequency 60 Hz
351 kV/in
@Frequency 60 Hz
step-by-step, wet; ASTM D149
 16.0 kV/mm
@Frequency 60 Hz
406 kV/in
@Frequency 60 Hz
short time, wet; ASTM D149
Dissipation Factor 0.020
@Frequency 1e+6 Hz
0.020
@Frequency 1e+6 Hz
wet; ASTM D150
Arc Resistance 178 sec178 secASTM D495
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 1.8 MPa (264 psi) >= 280 °C>= 536 °FPost Baked; ASTM D648A
 
Descriptive Properties
ColorBlack
FormGranular
Molding MethodCompression
 Transfer

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Bakelite® EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Sumitomo Bakelite North America Epiall® 2061B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Cheng Yu Plastic A705G3 ABS 30% Glass Fiber Reinforced
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound
Dow CYCLOTENE™ 3022-35 Bisbenzocyclobutene (BCB) Electronic Resin

P90X902 / 142677

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.