MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

solder replacement adhesives

Eutectic Solder (63Sn-37Pb) - ASTM B 32 Grade Sn63
Categories: Metal; Nonferrous Metal; Lead Alloy; Solder/Braze Alloy; Tin Alloy

Material Notes: Impurity limits in composition table are ASTM specs; other specification systems may allow other impurity limits. Solder is the largest use for tin in the U.S. Tin promotes adhesion to many base metals. This particular alloys is used as a solder in used in electronics because of its very low melting point.

Key Words: Tin Alloys; Lead Alloys
Vendors: Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.

 
Physical PropertiesMetricEnglishComments
Density 8.40 g/cc0.303 lb/in³
Viscosity  1.33 cP
@Temperature 280 °C
1.33 cP
@Temperature 536 °F
Dynamic viscosity
 45600 cP
@Temperature 280 °C
45600 cP
@Temperature 536 °F
Surface Tension  490 dynes/cm
@Temperature 280 °C
490 dynes/cm
@Temperature 536 °F
 490 dynes/cm
@Temperature 280 °C
490 dynes/cm
@Temperature 536 °F
 
Mechanical PropertiesMetricEnglishComments
Hardness, Brinell 1414Cast
Tensile Strength, Ultimate 52.0 MPa7540 psiCast solder. Typical Cu joint is 200 MPa.
Tensile Strength, Yield 43.0 MPa6240 psi
Elongation at Break 32 %32 %in 100 mm, Cast
Modulus of Elasticity 32.0 GPa4640 ksiInterpolated
Poissons Ratio 0.380.38
Shear Modulus 12.0 GPa1740 ksiCalculated
Shear Strength 37.0 MPa5370 psiTypical soldered Cu joint is 55 MPa.
Izod Impact 20.0 J14.8 ft-lbCast
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000145 ohm-cm0.0000145 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Heat of Fusion 37.0 J/g15.9 BTU/lb
CTE, linear 24.7 µm/m-°C
@Temperature 15.0 - 110 °C
13.7 µin/in-°F
@Temperature 59.0 - 230 °F
Thermal Conductivity 50.9 W/m-K
@Temperature 0.000 - 180 °C
353 BTU-in/hr-ft²-°F
@Temperature 32.0 - 356 °F
Melting Point 183 °C361 °F
Solidus 183 °C361 °F
Liquidus 183 °C361 °F
 
Component Elements PropertiesMetricEnglishComments
Aluminum, Al <= 0.0050 %<= 0.0050 %
Antimony, Sb <= 0.50 %<= 0.50 %
Arsenic, As <= 0.030 %<= 0.030 %
Bismuth, Bi <= 0.25 %<= 0.25 %
Cadmium, Cd <= 0.0010 %<= 0.0010 %
Copper, Cu <= 0.080 %<= 0.080 %
Iron, Fe <= 0.020 %<= 0.020 %
Lead, Pb 37 %37 %
Silver, Ag <= 0.015 %<= 0.015 %
Tin, Sn 63 %63 %
Zinc, Zn <= 0.0050 %<= 0.0050 %

References for this datasheet.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
60-40 Soft Solder (60 Sn-40Pb) - ASTM B 32 Grade Sn60
Indium Corp. Indalloy® 106 (Sn63) Sn-Pb Solder Alloy
AIM SAC305 Lead-Free Solder for Photonic Packaging
Tin-Silver Solder (95Sn-5Ag), ASTM B 32 Grade Sn95
AIM 63Sn/Pb37 Solder for Photonic Packaging

MLSS63 / 12275

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.