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Metal adhesives

Aptek DIS-A-PASTE 2001-PMF Thermally conductive urethane adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes: Premixed-frozen, thermally conductive urethane adhesive
DIS-A-PASTE 2001-PMF is a one component, premixed-frozen, mineral filled, and off-white electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2001-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being fully cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

Premixed-frozen and packaged in syringes for convenient dispensing to circuit board. Low modulus to minimize stress to sensitive components and ceramic substrates. Low Tg for excellent low temperature cycling and performance. Excellent substrate adhesion; superior to silicones. Bonds DAT-A-THERM 1000 thermally conductive urethane film to devices and substrates without loss of thermal conductivity. Product also available in 8-10 mil. bondline spacers-designated DIS-A-PASTE 2001/.01.

Information provided by Aptek Laboratories, Inc.
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Physical PropertiesMetricEnglishComments
Density 2.10 g/cc0.0759 lb/in³ASTM D1475
Viscosity 140000 cP140000 cPASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 8383Cured property; ASTM D2240
Adhesive Bond Strength 2.93 MPa425 psiAl-to-Al Lap Shear; Cured property; ASTM D1002
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 7.00e+14 ohm-cm7.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 5.8
@Frequency 1000 Hz		5.8
@Frequency 1000 Hz		Cured property; ASTM D150
Dielectric Strength 24.4 kV/mm
@Thickness 1.27 mm		620 kV/in
@Thickness 0.0500 in		Cured; ASTM D149
Dissipation Factor 0.030
@Frequency 1000 Hz		0.030
@Frequency 1000 Hz		Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  31.0 µm/m-°C
@Temperature 20.0 °C		17.2 µin/in-°F
@Temperature 68.0 °F		Cured property; alpha 1
 147 µm/m-°C
@Temperature 20.0 °C		81.7 µin/in-°F
@Temperature 68.0 °F		Cured property; alpha 2
Thermal Conductivity 1.38 W/m-K9.60 BTU-in/hr-ft²-°FCured property; COLORA
Glass Transition Temp, Tg -60.0 °C-76.0 °FCured property; JMTP P-200
Flash Point >= 200 °C>= 392 °FASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 85.0 °C185 °FCure 6 hrs
 100 °C212 °FCure 4 hrs
 125 °C257 °FCure 2 hrs

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PAPTEK01 / 24163

Metal adhesives




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