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Chemically Resistant adhesives

Cosmic Plastics FARBOSET® 1115 Black Mineral Filled Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled

Material Notes: Cosmic FARBOSET 1115 Black is a mineral filled epoxy molding compound featuring fast cure rates, and excellent hot strength. It is designed for the encapsulation of coils, transformers, bushings, switches and other electrical and electronic components requiring good hot rigidity in molding. This material is used extensively in injection and transfer molding.

Information provided by Cosmic Plastics Inc

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Bulk Density 1.00 g/cc0.0361 lb/in³powder
Density 2.04 g/cc0.0737 lb/in³
Water Absorption 0.026 %
@Time 86400 sec
0.026 %
@Time 24.0 hour
Linear Mold Shrinkage 0.0050 cm/cm0.0050 in/in
Spiral Flow 71.0 cm28.0 inEMMI 1-66A
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 9797
Tensile Strength at Break 86.2 MPa12500 psi
Flexural Strength 124 MPa18000 psi
Flexural Modulus 17.2 GPa2500 ksi
Compressive Strength 276 MPa40000 psi
Izod Impact, Notched 0.214 J/cm0.400 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 5.00e+16 ohm-cm>= 5.00e+16 ohm-cm
Surface Resistance >= 1.00e+16 ohm>= 1.00e+16 ohm
Dielectric Constant 4.5
@Frequency 1000 Hz
4.5
@Frequency 1000 Hz
Dielectric Strength >= 15.7 kV/mm>= 400 kV/inshort time 125 mil
Dissipation Factor 0.0070
@Frequency 1000 Hz
0.0070
@Frequency 1000 Hz
Dielectric Loss Index 0.032
@Frequency 1000 Hz
0.032
@Frequency 1000 Hz
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 32.0 µm/m-°C17.8 µin/in-°FAlpha 1
 86.9 µm/m-°C48.3 µin/in-°FAlpha 2
Thermal Conductivity 1.34 W/m-K9.28 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C392 °F
Deflection Temperature at 1.8 MPa (264 psi) 110 °C230 °F
Glass Transition Temp, Tg 130 °C266 °F
Flammability, UL94 V-0
@Thickness 1.59 mm
V-0
@Thickness 0.0625 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 150 - 180 °C302 - 356 °F
Cure Time  0.500 min
@Temperature 150 °C
0.00833 hour
@Temperature 302 °F
Hot Plate
 1.00 - 3.00 min
@Temperature 150 °C
0.0167 - 0.0500 hour
@Temperature 302 °F
Shelf Life  0.0670 Month
@Temperature 35.0 °C
0.0670 Month
@Temperature 95.0 °F
2 days
 0.250 Month
@Temperature 25.0 °C
0.250 Month
@Temperature 77.0 °F
1 week
 12.0 Month
@Temperature 5.00 °C
12.0 Month
@Temperature 41.0 °F
 
Descriptive Properties
Molding Pressure50-1000 psi

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PCOSM025 / 190807

Chemically Resistant adhesives

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