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Master Bond adhesives

Celanese Zytel® HTN54G35HSLR NC010 PA-IGF35
Categories: Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 40% Glass Fiber Reinforced

Material Notes: 35% Glass Reinforced, Toughened, PPA, High Performance Polyamide

Former DuPont product acquired by Celanese in 2022.

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Physical PropertiesMetricEnglishComments
Density 1.42 g/cc0.0513 lb/in³DAM; ISO 1183
Moisture Absorption 1.80 %
@Thickness 2.00 mm
1.80 %
@Thickness 0.0787 in
DAM; Sim. to ISO 62
Viscosity Number 105 cm³/g1.05 dl/gDAM; ISO 307, 1157, 1628
Linear Mold Shrinkage, Flow 0.0020 cm/cm0.0020 in/inDAM; ISO 294-4, 2577
Linear Mold Shrinkage, Transverse 0.0060 cm/cm0.0060 in/inDAM; ISO 294-4, 2577
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 180 MPa26100 psiDAM; ISO 527-1/-2
Elongation at Break 3.0 %3.0 %DAM; ISO 527-1/-2
Tensile Modulus 10.0 GPa1450 ksiDAM; ISO 527-1/-2
Flexural Modulus 9.00 GPa1310 ksiDAM; ISO 178
Poissons Ratio 0.340.34DAM
Charpy Impact Unnotched 7.50 J/cm²
@Temperature 23.0 °C
35.7 ft-lb/in²
@Temperature 73.4 °F
DAM; ISO 179/1eU
Charpy Impact, Notched  0.900 J/cm²
@Temperature -40.0 °C
4.28 ft-lb/in²
@Temperature -40.0 °F
DAM; ISO 179/1eA
 1.10 J/cm²
@Temperature 23.0 °C
5.23 ft-lb/in²
@Temperature 73.4 °F
50% RH; ISO 179/1eA
 1.20 J/cm²
@Temperature 23.0 °C
5.71 ft-lb/in²
@Temperature 73.4 °F
DAM; ISO 179/1eA
Tensile Creep Modulus, 1 hour 11000 MPa1.60e+6 psi1h; 50% RH; ISO 899-1
Tensile Creep Modulus, 1000 hours 10000 MPa1.45e+6 psi1000h; 50% RH; ISO 899-1
 
Electrical PropertiesMetricEnglishComments
Surface Resistance 1.00e+14 ohm1.00e+14 ohm50% RH; IEC 62631-3-2
Dielectric Strength 42.0 kV/mm1070 kV/in50% RH; IEC 60243-1
 43.0 kV/mm1090 kV/inDAM; IEC 60243-1
Comparative Tracking Index 600 V600 VDAM; IEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 20.0 µm/m-°C11.1 µin/in-°FDAM; ISO 11359-1/-2
 20.0 µm/m-°C
@Temperature -40.0 - 23.0 °C
11.1 µin/in-°F
@Temperature -40.0 - 73.4 °F
DAM; ISO 11359-1/-2
CTE, linear, Transverse to Flow 72.0 µm/m-°C40.0 µin/in-°FDAM; ISO 11359-1/-2
 75.0 µm/m-°C
@Temperature -40.0 - 23.0 °C
41.7 µin/in-°F
@Temperature -40.0 - 73.4 °F
DAM; ISO 11359-1/-2
Thermal Conductivity 0.350 W/m-K2.43 BTU-in/hr-ft²-°FSolid
Melting Point 300 °C572 °Ffirst heat; DAM; ISO 11357-1/-3
Deflection Temperature at 0.46 MPa (66 psi) 285 °C545 °FDAM; ISO 75-1/-2
Deflection Temperature at 1.8 MPa (264 psi) 255 °C491 °FDAM; ISO 75-1/-2
Glass Transition Temp, Tg 65.0 °C149 °F10°C/min; 50% RH; ISO 11357-1/-2
 115 °C239 °F10°C/min; DAM; ISO 11357-1/-2
 
Processing PropertiesMetricEnglishComments
Melt Temperature 325 °C617 °FOptimum, Injection
 320 - 330 °C608 - 626 °FRange, Injection
Mold Temperature 90.0 - 130 °C194 - 266 °FInjection
Drying Temperature 100 °C212 °FInjection
Dry Time 6.00 - 8.00 hour6.00 - 8.00 hourInjection, Dehumidified Dryer
Moisture Content <= 0.10 %<= 0.10 %Injection
 
Descriptive Properties
AdditivesRelease agent
Drying RecommendedyesInjection
FMVSS ClassSEISO 3795 (FMVSS 302)
ISO designationISO 16396-PA-I,GF35,M1GHNRW,S10-100
Part Marking Code>PA-IGF35<ISO 11469
 >PPA-IGF35<SAE J1344
PolymerPA*-I-GF35
Resin IdentificationPA-IGF35ISO 1043

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PDSX5442h / 291024

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