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Master Bond adhesives

BASF Ultrason® S 2010 PSU
Categories: Polymer; Thermoplastic; Polysulfone (PSU)

Material Notes: Ultrason S 2010 is an unreinforced, medium viscosity standard injection molding PSU grade. It flows readily and offers outstanding heat resistance and dimensional stability. It conforms to FDA requirements of 21 CFR 177.1655.

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Physical PropertiesMetricEnglishComments
Density 1.24 g/cc0.0448 lb/in³ISO 1183
Water Absorption 0.80 %0.80 %ISO 62
Moisture Absorption at Equilibrium 0.30 %0.30 %23°C/50% R.H.; ISO 62
Viscosity Number 63 cm³/g0.63 dl/g
Linear Mold Shrinkage, Flow 0.0068 cm/cm0.0068 in/inISO 294
Linear Mold Shrinkage, Transverse 0.0072 cm/cm0.0072 in/inISO 294
Melt Flow 90 g/10 min
@Load 10.0 kg,
Temperature 360 °C
90 g/10 min
@Load 22.0 lb,
Temperature 680 °F
ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 135 MPa19600 psiISO 11359-1/-2
Tensile Strength at Break 75.0 MPa10900 psi5mm/min; ISO 527-2
Tensile Strength, Yield 75.0 MPa10900 psi50mm/min; ISO 527-2
Elongation at Break 5.7 %5.7 %5mm/min; ISO 527-2
Elongation at Yield 5.7 %5.7 %50mm/min; ISO 527-2
Tensile Modulus 2.60 GPa377 ksiISO 527-2
Shear Modulus  0.0250 GPa
@Temperature 200 °C
3.63 ksi
@Temperature 392 °F
ISO 6721
 0.800 GPa
@Temperature 175 °C
116 ksi
@Temperature 347 °F
ISO 6721
 0.900 GPa
@Temperature 100 °C
131 ksi
@Temperature 212 °F
ISO 6721
 0.950 GPa
@Temperature 50.0 °C
138 ksi
@Temperature 122 °F
ISO 6721
Izod Impact, Notched (ISO) 5.00 kJ/m²2.38 ft-lb/in²ISO 180/A
 6.00 kJ/m²
@Temperature -30.0 °C
2.86 ft-lb/in²
@Temperature -22.0 °F
ISO 180/A
Charpy Impact Unnotched NBNBISO 179/1eU
 NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
ISO 179/1eU
Charpy Impact, Notched 0.550 J/cm²2.62 ft-lb/in²ISO 179/1eA
 0.0600 J/cm²
@Temperature -30.0 °C
0.286 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eA
Tensile Creep Modulus, 1000 hours 2500 MPa363000 psielongation <0.5%, 23°C; ISO 899
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+13 ohm-cm>= 1.00e+13 ohm-cmIEC 60093
Surface Resistance >= 1.00e+14 ohm>= 1.00e+14 ohmIEC 60093
Dielectric Constant  3.1
@Frequency 100 Hz
3.1
@Frequency 100 Hz
IEC 60250
 3.1
@Frequency 1e+6 Hz
3.1
@Frequency 1e+6 Hz
IEC 60250
Dielectric Strength 40.0 kV/mm1020 kV/inIEC 60243-1 3
Dissipation Factor  0.00080
@Frequency 100 Hz
0.00080
@Frequency 100 Hz
IEC 60250
 0.0064
@Frequency 1e+6 Hz
0.0064
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 125 V125 VTest Liquid A & B; IEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear  53.0 µm/m-°C
@Temperature 26.0 °C
29.4 µin/in-°F
@Temperature 78.8 °F
DIN 53752
 60.0 µm/m-°C
@Temperature 125 °C
33.3 µin/in-°F
@Temperature 257 °F
DIN 53752
 65.0 µm/m-°C
@Temperature 175 °C
36.1 µin/in-°F
@Temperature 347 °F
DIN 53752
CTE, linear, Parallel to Flow  53.0 µm/m-°C
@Temperature 23.0 - 80.0 °C
29.4 µin/in-°F
@Temperature 73.4 - 176 °F
ISO 11359-1/-2
 60.0 µm/m-°C
@Temperature 140 - 180 °C
33.3 µin/in-°F
@Temperature 284 - 356 °F
ISO 11359-1/-2
Maximum Service Temperature, Air 180 °C356 °Fshort cycle operations
Deflection Temperature at 1.8 MPa (264 psi) 167 °C333 °FISO 75
Glass Transition Temp, Tg 187 °C369 °FISO 11357-1/-3
UL RTI, Electrical 155 °C311 °F50% decrease of tensile strength after 20000h; 746B
Flammability, UL94  HB
@Thickness 1.60 mm
HB
@Thickness 0.0630 in
 V-2
@Thickness 3.20 mm
V-2
@Thickness 0.126 in
 
Optical PropertiesMetricEnglishComments
Refractive Index 1.631.63
 1.63
@Wavelength 550 nm
1.63
@Wavelength 550 nm
 1.63
@Wavelength 700 nm
1.63
@Wavelength 700 nm
 1.64
@Wavelength 590 nm
1.64
@Wavelength 590 nm
 1.65
@Wavelength 540 nm
1.65
@Wavelength 540 nm
 1.66
@Wavelength 450 nm
1.66
@Wavelength 450 nm
Transmission, Visible 89 %
@Thickness 2.00 mm
89 %
@Thickness 0.0787 in
ASTM D 1003
 75 %
@Wavelength 400 nm
75 %
@Wavelength 400 nm
 85 %
@Wavelength 500 nm
85 %
@Wavelength 500 nm
 85 %
@Wavelength 600 nm
85 %
@Wavelength 600 nm
UV Transmittance  3.0 %
@Wavelength 300 nm
3.0 %
@Wavelength 300 nm
 15 %
@Wavelength 200 nm
15 %
@Wavelength 200 nm
 40 %
@Wavelength 350 nm
40 %
@Wavelength 350 nm
 
Processing PropertiesMetricEnglishComments
Adapter Temperature 300 °C572 °F
Die Temperature 310 °C590 °F
Melt Temperature 330 - 390 °C626 - 734 °FInjection molding
Mold Temperature 120 - 160 °C248 - 320 °FInjection molding
Die Opening 110 cm43.3 in
 
Compliance PropertiesMetricEnglishComments
FDA YesYes21 CFR 177.1655
NSF YesYesNSF Std. 61
 
Descriptive Properties
ColorNatural
Commercial StatusNorth America and Europe
Impact ModifiedNo
Primary Processing TechniqueInjection Molding, Extrusion and Blow Molding

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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