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Chemically Resistant adhesives

Lord Adhesives Gelease™ MG-200 Thermally Conductive Silicone Gel Interface
Categories: Polymer; Thermoset; Silicone; Silicone Elastomer, for Thermal Management

Material Notes:

All information provided by Lord.

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Physical PropertiesMetricEnglishComments
Specific Gravity 2.56 g/cc2.56 g/ccASTM D1505
Viscosity  45000 cP
@Temperature 25.0 °C
45000 cP
@Temperature 77.0 °F
Parallel Plate Rheometer; 3.0rpm
 100000 cP
@Temperature 25.0 °C
100000 cP
@Temperature 77.0 °F
Parallel Plate Rheometer; 0.3rpm
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity 0.0000300 GPa0.00435 ksiStorage
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+13 ohm-cm
@Temperature 25.0 °C
2.00e+13 ohm-cm
@Temperature 77.0 °F
ASTM D257
 
Thermal PropertiesMetricEnglishComments
CTE, linear 90.0 µm/m-°C50.0 µin/in-°FAlpha 2
Thermal Conductivity 3.00 W/m-K20.8 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C392 °F
Glass Transition Temp, Tg -115 °C-175 °FASTM D3386
 
Processing PropertiesMetricEnglishComments
Cure Time  20.0 min
@Temperature 85.0 °C
0.333 hour
@Temperature 185 °F
 180 min
@Temperature 25.0 °C
3.00 hour
@Temperature 77.0 °F
Pot Life 2880 min
@Temperature 25.0 °C
2880 min
@Temperature 77.0 °F
Gel Time  3.00 min
@Temperature 85.0 °C
3.00 min
@Temperature 185 °F
 30.0 min
@Temperature 25.0 °C
30.0 min
@Temperature 77.0 °F
Shelf Life 6.00 Month
@Temperature -30.0 °C
6.00 Month
@Temperature -22.0 °F
 
Descriptive Properties
AppearanceGray
Thixotropic Index2.25

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PLORD028 / 86036

Chemically Resistant adhesives

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