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Chemically Resistant adhesives

Cosmic Plastics E4930R Mineral Filled Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled

Material Notes: Description: Cosmic E4930R is a mineral filled, application specific epoxy molding compound which is supplied in a granular form.

Features: It has excellent moisture resistance and thermal cycling stability. Standard spiral flow range is 30-40” (EMMI) at 1600C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi. It has a hot plate gel time of 35-45 seconds at 1600C.

Applications: Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS’s and QFP.

Information provided by Cosmic Plastics Inc

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.85 g/cc1.85 g/cc
Bulk Factor 2.0 - 5.02.0 - 5.0
Water Absorption 0.25 %
@Temperature 50.0 °C,
Time 173000 sec
0.25 %
@Temperature 122 °F,
Time 48.0 hour
Linear Mold Shrinkage 0.0020 - 0.0040 cm/cm0.0020 - 0.0040 in/in
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6565
Tensile Strength at Break 82.7 MPa12000 psi
Flexural Strength 103 MPa15000 psi
Flexural Modulus 13.8 GPa2000 ksi
Compressive Strength 193 MPa28000 psi
Izod Impact, Notched 0.320 J/cm0.600 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+15 ohm-cm1.00e+15 ohm-cm
Surface Resistance 1.00e+15 ohm1.00e+15 ohm
Dielectric Constant  4.2
@Frequency 1000 Hz
4.2
@Frequency 1000 Hz
Wet
 4.5
@Frequency 1e+6 Hz
4.5
@Frequency 1e+6 Hz
Wet
Dielectric Strength 13.8 kV/mm350 kV/inWet, step by step
Dielectric Breakdown 56 V56 VWet, step by step
Dissipation Factor  0.011
@Frequency 1e+6 Hz
0.011
@Frequency 1e+6 Hz
Wet
 0.012
@Frequency 1000 Hz
0.012
@Frequency 1000 Hz
Wet
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 25.0 µm/m-°C13.9 µin/in-°FAlpha 1
 80.0 µm/m-°C44.4 µin/in-°FAlpha 2
Thermal Conductivity 1.26 W/m-K8.70 BTU-in/hr-ft²-°F
Heat Distortion Temperature 260 °C500 °F
Glass Transition Temp, Tg 165 °C329 °F
Flammability, UL94 V-0
@Thickness 3.17 mm
V-0
@Thickness 0.125 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 150 - 180 °C302 - 356 °F
 
Descriptive Properties
Molding Pressure500-8000 psi

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PCOSM020 / 190802

Chemically Resistant adhesives

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