GeleaseTM MG-120 is a one-component thermally conductive silicone gel interface material that has the low thermal resistance properties of a grease while possessing the integrity of a gel. GeleaseTM MG-120 is designed to provide the most efficient heat transfer from Flip Chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The crosslink structure of GeleaseTM MG-120 inhibits bleed, separation and pump-out, which are typically observed in many thermal interface materialsAll information provided by Lord. |