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Chemically Resistant adhesives

Lord Adhesives Gelease™ MG-120 Thermally Conductive Silicone Gel Interface
Categories: Fluid; Lubricant; Silicone Base; Silicone, Filled Grease

Material Notes: GeleaseTM MG-120 is a one-component thermally conductive silicone gel interface material that has the low thermal resistance properties of a grease while possessing the integrity of a gel. GeleaseTM MG-120 is designed to provide the most efficient heat transfer from Flip Chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The crosslink structure of GeleaseTM MG-120 inhibits bleed, separation and pump-out, which are typically observed in many thermal interface materials

All information provided by Lord.

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Physical PropertiesMetricEnglishComments
Specific Gravity 2.57 g/cc2.57 g/ccASTM D1505
Viscosity 100000 cP100000 cPASTM D2393, 10rpm
 400000 cP400000 cPASTM D2393, 1rpm
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity 0.0000150 GPa0.00218 ksiStorage
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 8.00e+13 ohm-cm
@Temperature 25.0 °C
8.00e+13 ohm-cm
@Temperature 77.0 °F
ASTM D257
 
Thermal PropertiesMetricEnglishComments
CTE, linear 232 µm/m-°C129 µin/in-°FAlpha 2
Thermal Conductivity 2.80 W/m-K19.4 BTU-in/hr-ft²-°FASTM F433
Maximum Service Temperature, Air 200 °C392 °F
Glass Transition Temp, Tg -121 °C-186 °FASTM D3386
 
Processing PropertiesMetricEnglishComments
Cure Time  30.0 min
@Temperature 150 °C
0.500 hour
@Temperature 302 °F
 60.0 min
@Temperature 120 °C
1.00 hour
@Temperature 248 °F
Pot Life 4320 min
@Temperature 25.0 °C
4320 min
@Temperature 77.0 °F
Shelf Life  3.00 Month
@Temperature -5.00 °C
3.00 Month
@Temperature 23.0 °F
 6.00 Month
@Temperature -30.0 °C
6.00 Month
@Temperature -22.0 °F
 
Descriptive Properties
AppearanceGray
Thermal Impedance (ºC-in²/W)0.11-0.12In-House Custom Build Thermal Tester
Thixotropic Index4

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PLORD025 / 86033

Chemically Resistant adhesives

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