A. Schulman BMC 940 Vinyl Ester Bipolar Plate Material

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A. Schulman BMC 940 Vinyl Ester Bipolar Plate Material
Categories:	Polymer; Thermoset; Vinyl Ester; Vinyl Ester Sheet Molding Compound
Material Notes:	Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC thermosets are the most cost-effective plastic products on the market today. The process of manufacturing BMC thermosets is geared toward high-volume, automated systems to ensure the highest quality at the lowest possible cost. BMC thermosets can be designed to conduct electricity for use in applications such as bipolar plates that are used in fuel cells.
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Physical Properties	Metric	English	Comments

Specific Gravity	1.82 g/cc	1.82 g/cc	ASTM D792
Water Absorption	<= 0.060 %	<= 0.060 %	24 hours, 23°C; ASTM D570
Linear Mold Shrinkage	0.0010 cm/cm	0.0010 in/in	ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength, Ultimate	>= 30.3 MPa	>= 4400 psi	ASTM D638
Flexural Strength	>= 40.0 MPa	>= 5800 psi	ASTM D790
Flexural Modulus	>= 10.3 GPa	>= 1500 ksi	ASTM D790
Izod Impact, Unnotched	0.160 J/cm	0.300 ft-lb/in
Dynatup @ -18°C	3.57 J	2.63 ft-lb
Dynatup @ -18°C Max Load	76600 g	169 lb

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.010 ohm-cm	0.010 ohm-cm	in plane
	0.020 ohm-cm	0.020 ohm-cm	Through plane

Thermal Properties	Metric	English	Comments
CTE, linear	>= 30.0 µm/m-°C @Temperature 20.0 °C	>= 16.7 µin/in-°F @Temperature 68.0 °F
Specific Heat Capacity	0.841 J/g-°C	0.201 BTU/lb-°F	through-plane
Thermal Conductivity	19.2 W/m-K	133 BTU-in/hr-ft²-°F	Through Plane
	46.2 W/m-K	321 BTU-in/hr-ft²-°F	In-Plane
	18.5 W/m-K @Temperature 85.0 °C	128 BTU-in/hr-ft²-°F @Temperature 185 °F	Through Plane
	43.7 W/m-K @Temperature 85.0 °C	303 BTU-in/hr-ft²-°F @Temperature 185 °F	In Plane
Glass Transition Temp, Tg	>= 200 °C	>= 392 °F
Flammability, UL94	V-0 @Thickness 3.56 mm	V-0 @Thickness 0.140 in

Processing Properties	Metric	English	Comments
Mold Temperature	163 - 168 °C	325 - 335 °F
Cure Time	0.500 - 1.00 min	0.00833 - 0.0167 hour

Descriptive Properties
Compressive Creep, 200 psi	0.025%		200hr @ 80°C
	0.04%		1000hr @ 80°C
Diffusivity, cm²/s	0.098		85°C Through Plane
	0.125		25°C Through Plane
	0.231		85° In-Plane
	0.302		25° In-Plane
DMA-Modulus	0.5		10^6 psi, 200°C
	0.94		10^6 psi, 175°C
	1.23		10^6 psi, 150°C
	1.6		10^6 psi, 100°C
	2		10^6 psi, 25°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PBMC069 / 27252

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