Lord Adhesives CoolTherm™ SC6711/6731 Silicone Encapsulant

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Lord Adhesives CoolTherm™ SC6711/6731 Silicone Encapsulant
Categories:	Polymer; Thermoset; Silicone; Silicone Elastomer, for Thermal Management
Material Notes:	LORD CoolTherm™ SC-6711/6731 silicone encapsulant is a two-component, thermally conductive encapsulant system with outstanding electrical properties. CoolTherm SC-6711/6731 encapsulant system is an ideal potting compound for any application where rapid heat transfer, high temperature service and a flexible system are required. Features: maintains low viscosity for complete and void-free encapsulation. provides thermal conductivity for applications where superior heat dissipation are required. minimizes the possibility of cracking during severe temperature cycling. All information provided by Lord.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	1.10 g/cc	1.10 g/cc	SC-6731 Hardener
	2.20 g/cc	2.20 g/cc	SC-6711 WHT Silicone Resin
Viscosity	100 cP @Temperature 25.0 °C	100 cP @Temperature 77.0 °F	SC-6731 Hardener
	30000 cP @Temperature 25.0 °C	30000 cP @Temperature 77.0 °F	SC-6711 WHT Silicone Resin

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	60	60	cured
Tensile Strength	5.52 MPa @Temperature 25.0 °C	800 psi @Temperature 77.0 °F	cured
Elongation at Break	70 %	70 %	cured

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+14 ohm-cm @Temperature 25.0 °C	1.00e+14 ohm-cm @Temperature 77.0 °F	cured
Dielectric Constant	5.2	5.2	cured
Dielectric Strength	19.7 kV/mm	500 kV/in	cured
Dissipation Factor	0.020	0.020	cured

Thermal Properties	Metric	English	Comments
CTE, linear	150 µm/m-°C	83.3 µin/in-°F	cured
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	cured, hot die transient method

Processing Properties	Metric	English	Comments
Cure Time	720 - 960 min @Temperature 25.0 °C	12.0 - 16.0 hour @Temperature 77.0 °F	mixed
Pot Life	60.0 - 120 min @Temperature 25.0 °C	60.0 - 120 min @Temperature 77.0 °F	mixed, working life
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F	each component, from date of manufacture when stored in original, unopened container

Descriptive Properties
Appearance	Light Amber Translucent Liquid		SC-6731 Hardener
	White Paste		SC-6711 WHT Silicone Resin
Usage Level % by weight	0.5		mixed

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Lord Adhesives CoolTherm™ SC-6709/6730 Silicone encapsulant system
Lord Adhesives CoolTherm™ SC-6710/6731 Silicone Resin System
Lord Adhesives CoolTherm™ SC6711/6730 Silicone Encapsulant
Lord Adhesives CoolTherm™ SC6711/6732 Silicone Encapsulant
Lord Adhesives CoolTherm™ SC-6712/6730 Silicone Resin System

PLORD9245 / 232601

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message