Aptek 6100-1A/B Epoxy Encapsulant

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Aptek 6100-1A/B Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Optoelectronic grade, water clear encapsulant for IR and visible LED discreet devices. Lower Tg versions available for display devices. Part A is dark blue. Part B is clear to pale yellow. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	1.18 g/cc	0.0426 lb/in³	A Component; ASTM D1475
	1.20 g/cc	0.0434 lb/in³	B Component; ASTM D1475
Viscosity	350 cP	350 cP	B Component; Spindle #2; speed 50 rpm; ASTM D1824
	1900 cP	1900 cP	A Component; Spindle #2; speed 10 rpm; ASTM D1824

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	89	89	Cured property; ASTM D2240

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm	>= 1.00e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.7 @Frequency 1000 Hz	3.7 @Frequency 1000 Hz	Cured property; ASTM D150
Dissipation Factor	0.015 @Frequency 1000 Hz	0.015 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	<= 85.0 µm/m-°C @Temperature 20.0 °C	<= 47.2 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
	<= 275 µm/m-°C @Temperature 20.0 °C	<= 153 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg	>= 125 °C	>= 257 °F	Cured property; Perkin Elmer TMS-2
Flash Point	>= 150 °C	>= 302 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

Processing Properties	Metric	English	Comments
Processing Temperature	115 °C	239 °F	Cure 12 hrs.

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