ASI® MP 5400 Epoxy Adhesive

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ASI® MP 5400 Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	MP5400 is a one component, heat curable thixotropic paste epoxy adhesive. It is a non-sag adhesive which forms strong bonds to metals and ceramics. MP5400 has exceptional thermal stability and resistance to water, humidity and solvents. This product offers high heat resistance and cures rapidly in either a convection oven or infra-red oven. MP5400 readily exceeds all requirements of military specifications MMMA-132 for type II heat resistant structural adhesives. Information provided by Adhesive Systems, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.41 g/cc @Temperature 25.0 °C
Viscosity	700000 - 900000 cP @Temperature 25.0 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75 @Temperature 120 °C
	85 @Temperature 25.0 °C
Tensile Strength	>= 6400 psi
Elongation at Break	>= 1.5 %
Adhesive Bond Strength	>= 3100 psi	Lap Shear
Izod Impact, Notched	0.360 ft-lb/in

Thermal Properties	Original Value	Comments
CTE, linear	56.0 µm/m-°C
Maximum Service Temperature, Air	400 °F
Minimum Service Temperature, Air	-40.0 °F
Glass Transition Temp, Tg	148 °C

Processing Properties	Original Value	Comments
Cure Time	2.00 min @Temperature 121 °C
	10.0 min @Temperature 149 °C
	15.0 min @Temperature 121 °C
Shelf Life	0.500 Month @Temperature 38.0 °C
	6.00 Month @Temperature 24.0 °C
	12.0 Month @Temperature <=0.000 °C	Store in a cool, dry area

Descriptive Properties
Color / appearance	gray
Press Flow	60-80 sec
Sag Resistance	0.375"-0.42"

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PASINC9099 / 233466

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