Arlon Electronic Materials 45NK Woven Kevlar® Reinforced Laminate and Prepreg

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Arlon Electronic Materials 45NK Woven Kevlar® Reinforced Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy; Epoxy/Carbon Fiber Composite
Material Notes:	45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate system engineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCCs) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC-4101/50 (Type AFG). High Tg (170°C) for improved reliability through process and in-use Low Dielectric Constant 3.9 High modulus (19 Mpsi) p-aramid woven fiber reinforcement with CTE of -4 ppm/°C provides superior X-Y CTE of 5-7 ppm/°C Process compatible with conventional high Tg multifunctional epoxy systems 100% Organic resin/reinforcement system is suitable for laser drilling RoHS/WEEE compliant Typical Applications: SMT Board Designs using LCCCs or other low expansion chip carriers SMT Designs requiring both low in-plane CTE and laser drilling Information provided by ARLON Electronic Materials.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Metric	English	Comments

Density	1.50 g/cc	0.0542 lb/in³	ASTM D792 Method A
Water Absorption	0.80 %	0.80 %	IPC TM-650 2.6.2.1

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	27.6 GPa	4000 ksi	IPC TM-650 2.4.18.3
Poissons Ratio	0.20	0.20	ASTM D3039
Peel Strength	1.05 kN/m	6.00 pli	To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8
	1.05 kN/m	6.00 pli	To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8
	1.05 kN/m	6.00 pli	To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.30e+13 ohm-cm	1.30e+13 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	3.20e+13 ohm	3.20e+13 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	3.9 @Frequency 1e+6 Hz	3.9 @Frequency 1e+6 Hz	may vary with resin %; IPC TM-650 2.5.5.3
Dielectric Strength	>= 29.5 kV/mm	>= 750 kV/in	IPC TM-650 2.5.6.2
Dissipation Factor	0.016 @Frequency 1e+6 Hz	0.016 @Frequency 1e+6 Hz	IPC TM-650 2.5.5.3

Thermal Properties	Metric	English	Comments
CTE, linear	5.00 - 7.00 µm/m-°C	2.78 - 3.89 µin/in-°F	IPC TM-650 2.4.41
CTE, linear, Transverse to Flow	75.0 µm/m-°C	41.7 µin/in-°F	z, below Tg; IPC TM-650 2.4.24
	225 µm/m-°C	125 µin/in-°F	z, above Tg; IPC TM-650 2.4.24
Thermal Conductivity	0.220 W/m-K	1.53 BTU-in/hr-ft²-°F	ASTM E1461
Glass Transition Temp, Tg	170 °C	338 °F	DSC; IPC TM-650 2.4.25
Flammability, UL94	V-0	V-0

Descriptive Properties
Z-Axis Expansion (%)	2.8		IPC TM-650 2.4.24 (50-260°C)

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