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Ensinger PEI

Arlon Electronic Materials 47N Quick Cure Epoxy Low-Flow Prepreg
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes: 47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.

  • Tetrafunctional modified epoxy resin system with a Tg of 130°C.
  • Optimized bond to aluminum and copper heat sinks - typical lap shear 1000 psi
  • Cure temperature as low as 150°C
  • Engineered with discrete flow ranges and fiberglass styles for optimal process flexibility
  • Electrical and mechanical properties meeting the requirements of IPC-4101/21, modified to be "Low-Flow"
  • RoHS/WEEE compliant
  • Cost competitive for high volume commercial applications

Typical Applications:

  • Bonding multilayer epoxy rigid-flex
  • Attaching heat sinks to multilayer PCBs
  • Dielectric insulators
|

Information provided by ARLON Electronic Materials.
Vendors: Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets.

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Physical PropertiesMetricEnglishComments
Density 1.75 g/cc0.0632 lb/in³ASTM D792 Method A
Water Absorption 0.10 %0.10 %IPC TM-650 2.6.2.1
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity 17.9 GPa2600 ksiIPC TM-650 2.4.18.3
Poissons Ratio 0.170.17ASTM D3039
Peel Strength 1.58 kN/m9.00 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.10e+13 ohm-cm5.10e+13 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
 7.40e+13 ohm-cm7.40e+13 ohm-cmE24/125; IPC TM-650 2.5.17.1
Surface Resistance 1.50e+12 ohm1.50e+12 ohmE24/125; IPC TM-650 2.5.17.1
 8.80e+12 ohm8.80e+12 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant 4.3
@Frequency 1e+6 Hz		4.3
@Frequency 1e+6 Hz		IPC TM-650 2.5.5.3
Dielectric Strength 39.4 kV/mm1000 kV/inIPC TM-650 2.5.6.2
Dissipation Factor 0.022
@Frequency 1e+6 Hz		0.022
@Frequency 1e+6 Hz		IPC TM-650 2.5.5.3
 
Thermal PropertiesMetricEnglishComments
CTE, linear 15.0 - 17.0 µm/m-°C8.33 - 9.44 µin/in-°FIPC TM-650 2.4.41
CTE, linear, Transverse to Flow 85.0 µm/m-°C
@Temperature <=130 °C		47.2 µin/in-°F
@Temperature <=266 °F		z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.250 W/m-K1.74 BTU-in/hr-ft²-°FASTM E1461
Glass Transition Temp, Tg 130 °C266 °FDSC; IPC TM-650 2.4.25
Decomposition Temperature 295 °C563 °FOnset; IPC TM-650 2.3.41
 315 °C599 °F5 percent; IPC TM-650 2.3.41
Flammability, UL94 V-0V-0
 
Descriptive Properties
IPC Delamination - T260 (minutes)18IPC TM-650 2.4.24.1
IPC Delamination - T288 (minutes)0
IPC Delamination - T300 (minutes)0

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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