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Chemically Resistant adhesives

Cotronics Duralco™ 132 500°F (260°C) Aluminum Filled Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Aluminum filled epoxy that cures at room temperature to form machinable, thermally conductive bond lines. High heat transfer. Can be supplied as a “non-sag” putty.

Applications: heat tacking, heat transfer, and heat sink applications, i.e. bonding copper coils to vessels to provide for rapid heating and cooling for critical chemical processes.

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Physical PropertiesMetricEnglishComments
Viscosity 22000 cP22000 cP
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+6 ohm-cm1.00e+6 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 5.76 W/m-K40.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 260 °C500 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 960 - 1440 min
@Temperature 93.3 °C
16.0 - 24.0 hour
@Temperature 200 °F

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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Chemically Resistant adhesives

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