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Master Bond adhesives
Parker Chomerics TecknitĀ® 72-00008 Silver-Filled Epoxy System
Categories: Polymer; Thermoset; Epoxy; Epoxy Cure Resin

Material Notes: Description: This commercial grade, conductive epoxy is designed for use in bonding applications where good conductivity is required. When mixed in a ratio of 1:1.4 by volume or weight, the two components produce a light colored creamy paste which can be easily applied.

Information provided by Chomerics

Vendors:
Available Properties
  • Shear Strength, ASTM D1002, Cured
  • Volume Resistivity, QAP-1017, Cured
  • Maximum Service Temperature, Air, Cured
  • Minimum Service Temperature, Air, Cured
  • Shrinkage, Cured
  • Cure Time, Recommended Cure
  • Pot Life
  • Shelf Life, Unopened Container
  
Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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