Product Highlights:- Exceptionally high Tg
- Very good flow properties
- Superior chemical resistance
- Long working life at room temperature
- Exceptional electrical insulation properties
- Phenomenal abrasion resistance
Kohesi Bond KB 1372 SC is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This epoxy system offers a high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures. It takes 4 - 6 hours to cure at 70°C, 20 - 40 minutes at 100°C and 10 minutes at 125°C. Kb 1372 SC is an silicon carbide filled system, offering first-rate abrasion resistance. It offers very long working life at room temperature, allowing to bond and pot large parts. It has an extensive service temperature range of -50°C to +230°C. This adhesive fosters outstanding mechanical strength properties, along with dimensional stability. KB 1372 SC adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of acids, bases, solvents and other chemicals. Part A and Part B are dark gray in color. KB 1372 SC is widely used in applications requiring excellent chemical resistance at elevated temperatures, long open time and very high abrasion resistance. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |