Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy

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Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353ND-T for applications needing decreased flow Advantages & Application Notes: Suitable for fiber optic, medical grade, circuit assembly applications. Recommended for bonding metals, glass, ceramics and many types of plastic. High temperature adhesive for hybrids and medical devices; it can resist the 300°C temperature range for long periods of time. Used in circuit assembly applications; staking SMDs to PCB, bonding ferrite cores together in copper coil windings, inductor coils and power devices; also suitable for COB glob-top DAM material. Alternative product versions available with distinct viscosity ranges Can be applied by screen printing, spatula, hand held or automatic dispensing equipment. Amber color change when properly cured for easy visual ID and inspection. Information Provided by Epoxy Technology
Vendors:

Available Properties

Specific Gravity, Part B
Specific Gravity, Part A
Particle Size
Viscosity, 20 rpm
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Lap
Shear Strength, Die
Volume Resistivity
Dielectric Constant
Dissipation Factor
CTE, linear, Below Tg
CTE, linear, Above Tg
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Cure Time, Minimum Bond Line
Cure Time, Minimum Bond Line
Cure Time, Minimum Bond Line
Cure Time, Minimum Bond Line
Pot Life
Shelf Life, refrigerated

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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