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Master Bond adhesives
Daikin DAI-EL® G-702 Fluoroelastomer Copolymer, Bisphenol Curable Grade, 66% Fluorine Content
Categories: Polymer; Thermoset; Fluoropolymer, TS; Thermoset Fluoroelastomer; Rubber or Thermoset Elastomer (TSE)

Material Notes: DAI-EL® G-702 is a bisphenol cure-incorporated copolymer with medium Mooney viscosity. It is designed for transfer or compression molding of complex parts where higher elongation at molding temperatures is required for easy part demolding.

Typical Applications: Seals, diaphragms, other dynamic applications

Rheological Properties MDR 2000:
Temperature: 177°C
Frequency: 100 cpm
Strain: 0.5°
Test time: 6 min

Rheological Properties ODR:
Temperature: 177°C
Frequency: 100 cpm
Strain: 3 °
Test time: 12 min

Information provided by Daikin.

Vendors:
Available Properties
  • Specific Gravity
  • Mooney Viscosity, ML 1+10
  • Hardness, Shore A, MDR 2000
  • Hardness, Shore A, ODR
  • Tensile Strength at Break, MDR 2000
  • Tensile Strength at Break, ODR
  • Elongation at Break, MDR 2000
  • Elongation at Break, ODR
  • 100% Modulus, MDR 2000
  • 100% Modulus, ODR
  • Compression Set, ASTM D395 Method B, #214 O-ring, ODR
  • Compression Set, ASTM D395 Method B, #214 O-ring, MDR 2000
  • Minimum Service Temperature, Air, ASTM D1329, Low Temperature Retraction
  • Cure Time, ts2, scorch time, MDR 2000
  • Cure Time, t'50, time to 50% cure, MDR 2000
  • Cure Time, ts2, scorch time, ODR
  • Cure Time, t'90, time to 90% cure, MDR 2000
  • Cure Time, t'50, time to 50% cure, ODR
  • Cure Time, t'90, time to 90% cure, ODR
  • Cure Time, Press Cure, ODR
  • Cure Time, Press Cure, MDR 2000
  • Cure Time, Post Cure, MDR 2000
  • Cure Time, Post Cure, ODR
  • Fluorine, F
  
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Manufacturer Notes:
Daikin Industries

Category Notes
Plastic

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