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Metal adhesives
Master Bond EP3HTS-TC One component, silver filled epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Electrically Conductive; Epoxy, Thermally Conductive

Material Notes: Key Features:
  • For bonding, sealing and coating
  • Not premixed and frozen
  • Very long open time at room temperature
  • Cures rapidly at 250 to 300°F
Product Description: Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. It is not premixed and frozen and has an unlimited working life at room temperature. It has a paste consistency and dispenses easily from a syringe. It cures rapidly at 250 to 300°F with minimal flow and low shrinkage upon curing. This epoxy should be stored in a refrigerator at 40 to 50°F. Although this product can be used for sealing and coating, its main use is as an adhesive for die attach and general bonding purposes. EP3HTS-TC bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. As a die attach adhesive, it dispenses smoothly and easily. It is well suited for automatic dispensing equipment and can be applied without any tailing. For other types of bonding, it combines remarkable thermal and electrical conductivity. In fact, the thermal conductivity exceeds 16 W/(m-k). Along with this, the maximum particle size is about 20 microns, and when these numbers are combined, the thermal resistance is a remarkable 1-5 x 10¯6 K-m2/W. Other desirable attributes include excellent dimensional stability, resistance to thermal cycling, and a low coefficient of thermal expansion. The temperature range is -80°F to +400°F. EP3HTS-TC also passes NASA low outgassing specifications. There are 2 scenarios where EP3HTS-TC would be a top candidate. The first is in applications where the lowest possible volume resistivity is required. The second is when pre-eminent thermal conductivity is necessary and the need for electrical conductivity is not a pertinent issue.

Product Advantages:

  • Single component system, no mixing needed
  • Not premixed and frozen, unlimited working life
  • Ideal viscosity for die attach and general bonding
  • Spectacular electrical and thermal conductivity
  • NASA low outgassing

Information provided by Master Bond.

Vendors:
Available Properties
  • Specific Gravity
  • Solids Content
  • Hardness, Shore D
  • Tensile Strength
  • Tensile Modulus
  • Adhesive Bond Strength, Tensile lap shear, Al to Al
  • Volume Resistivity
  • CTE, linear
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg
  • Cure Time, Option 2 (add 1-2 hours at 250-300°F)
  • Cure Time, Option 1 (add 1-2 hours at 250-300°F)
  • Shelf Life, in original, unopened containers
  
Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Metal adhesives
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