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Master Bond adhesives
Kohesi Bond KB 16842 LV Two component, low viscosity, room temperature curing epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Product Highlights:
  • Ideal for potting
  • Excellent flow properties
  • Forgiving mix ratio
  • Outstanding electrical insulation properties
  • Exceptional physical strength properties
  • Stellar dimensional stability
Kohesi Bond KB 16842 LV is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has an easy 100:50 (Part A: Part B) mix ratio by weight or volume. This epoxy system can be adjusted to your hardness requirements by varying its mix ratio. Higher concentration of Part A (2:1 mix ratio) makes it more rigid, whereas a higher concentration of Part B (1:2 mix ratio) makes it more forgiving. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C-90°C for 3-5 hours. KB 16842 LV offers an extensive service temperature range of -55°C to +140°C. It has outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure. KB 16842 LV adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation. Part A is clear in color and Part B is amber in color. This product is available in a variety of colors and can be color matched to your specifications. KB 16842 LV is widely used in electronics, medical, food and specialty OEM industries.

Typical Applications:

  • Bonding
  • Sealing
  • Coating
  • Potting
  • Encapsulation

Information provided by Kohesi Bond Custom Engineered Adhesives

Vendors:
Available Properties
  • Density, Part B
  • Density, Part A
  • Viscosity, Part A
  • Viscosity, Mixed
  • Viscosity, Part B
  • Hardness, Shore D
  • Tensile Strength
  • Tensile Modulus
  • Adhesive Bond Strength, Tensile Lap Shear, Al/Al
  • Volume Resistivity
  • Dielectric Constant
  • CTE, linear
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, Option 2
  • Cure Time, Optimum Cure: overnight at 23°C plus 3 - 5 hours at 70°C - 90°C
  • Cure Time, Option 1
  • Working Life, 100 g of mixed epoxy
  • Shelf Life, in original unopened containers
  
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Manufacturer Notes:
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Category Notes
Plastic

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