AIM SAC305 Lead-Free Solder for Photonic Packaging

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RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

AIM SAC305 Lead-Free Solder for Photonic Packaging
Categories:	Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. Uses include: Fiber to Ferrule Soldering Laser Die Attach Hermetic Packaging & Sealing Wetting & Sealing Laser Optics Thermal Management Information provided by AIM Specialty Materials.
Vendors:

Available Properties

Density
Tensile Strength, Ultimate
CTE, linear
Melting Point
Solidus
Liquidus
Processing Temperature, Wave soldering pot temperature
Aluminum, Al, typical impurity level
Antimony, Sb, typical impurity level
Arsenic, As, typical impurity level
Bismuth, Bi, typical impurity level
Cadmium, Cd, typical impurity level
Copper, Cu
Indium, In, typical impurity level
Iron, Fe, typical impurity level
Lead, Pb, typical impurity level
Nickel, Ni, typical impurity level
Silver, Ag
Tin, Sn, as balance
Zinc, Zn, typical impurity level

Property Data

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Manufacturer Notes:
AIM Specialty Materials

Category Notes
none

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