Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach. Advantages & Application Notes: - Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.
- Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C and organic burn-in up to 150°C/1000 hours storage.
- Yields low levels of water extractable monovalent ions such as chlorides.
- Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.
- Silver-filled epoxy used for opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT.
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