Aptek 6500-PMF Electrically conductive epoxy adhesive

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Aptek 6500-PMF Electrically conductive epoxy adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Electrically Conductive
Material Notes:	High purity, low outgassing, electrically conductive adhesive APTEK 6500-PMF is a one component, pre-mixed frozen, 100% solid, silver-filled epoxy adhesive specifically designed for microelectronic die attach applications High purity resin system for minimum level of ionic contamination to prevent corrosion problems; High cross-link density to maintain stability and minimize outgassing during operational life even in high-vacuum environments and sealed packages; Smooth thixotropic consistency for machine stamping applications; Viscosity can be factory controlled for screening or dispensing applications; Contains no diluents or solvents to minimize formation of voids during cure Information provided by Aptek Laboratories, Inc.
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Available Properties

Density, ASTM D1475
Viscosity, Spindle #5; 10 rpm; ASTM D1824
Outgassing - Total Mass Loss, Cured property at 125ºC; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material, Cured property at 125ºC; at 10E-6 torr; ASTM E595
Hardness, Shore D, ASTM D2240
Adhesive Bond Strength, Al-to-Al Lap Shear; Cured property; ASTM D1002
Adhesive Bond Strength, Cured property; Die Shear for Ag to Si, 0.07" x 0.07" IC
Volume Resistivity, Cured property; ASTM D257
CTE, linear, Perkin Elmer TMS-2, Cured property; alpha 1
CTE, linear, Perkin Elmer TMS-2, Cured property; alpha 2
Glass Transition Temp, Tg, Cured property; Perkin-Elmer TMS-2
Flash Point, ASTM D92
Processing Temperature, Cure 2 hrs
Processing Temperature, Cure 2 hrs

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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