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Chemically Resistant adhesives
Rogers Arlon AD300C Commercial Microwave and RF Laminate Material
Categories: Polymer; Thermoset

Material Notes:
  • Excellent Thermal Coefficient of Dielectric Constant (TCEr = -25 ppm/°C)
  • Excellent PIM performance
  • High Thermal Conductivity ideal for Higher Power Designs
  • Reduced Coefficient of Thermal Expansion in z-direction (CTEz)
  • Cost-effective Advanced Material for Commercial RF Applications and High Volume Manufacturing Design
  • Tightest Commercial Laminate DK Tolerance for Impedance Control

Benefits:

  • Low Dielectric Loss (Loss Tangent)
  • Lower Insertion Loss (S21)
  • Excellent Electrical Phase Stability vs. Temperature
  • Excellent Copper Bond Strength
  • Low Moisture Absorption

Typical Applications:

  • Base Station Antennas
  • Power Amplifiers (PA), Tower Mounted Amplifiers (TMA) and Tower Mounted Booster Amplifiers (TMB)
  • Antenna Feed Networks
  • RF Passive Components
  • Multimedia Transmission Systems

Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.

Vendors:
Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650 2.6.2.1
  • Tensile Strength, IPC TM-650 2.4.18.3, Machine
  • Tensile Strength, IPC TM-650 2.4.18.3, Cross
  • Modulus of Elasticity, IPC TM-650 2.4.18.3
  • Flexural Strength, IPC TM-650 2.4.4, Machine
  • Flexural Strength, IPC TM-650 2.4.4, Cross
  • Poissons Ratio, ASTM D3039
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
  • Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
  • Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
  • Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
  • Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
  • Surface Resistance, IPC TM-650 2.5.17.1, E24/125
  • Dielectric Constant, IPC TM-650 2.5.5.3, may vary by thickness
  • Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
  • Dielectric Strength, IPC TM-650 2.5.6.2
  • Dielectric Breakdown, IPC TM-650 2.5.6
  • Dissipation Factor, IPC TM-650 2.5.5.3
  • Dissipation Factor, IPC TM-650 2.5.5.5
  • Arc Resistance, IPC TM-650 2.5.1
  • CTE, linear, IPC TM-650 2.4.41, x direction
  • CTE, linear, IPC TM-650 2.4.41, y direction
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
  • Thermal Conductivity, ASTM E1461
  • Decomposition Temperature, IPC TM-650 2.4.24.6, Onset
  • Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
  • Flammability, UL94
  
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Category Notes
Plastic

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Chemically Resistant adhesives
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