Product Highlights:- High glass transition temperature
- First-rate mechanical strength properties
- Castable up to 3 inches; ideal for potting
- Superior chemical resistance
- Exceptional electrical insulation properties
- Capable of passing NASA low outgassing
Kohesi Bond KB 1452 HT-2LO is a two component, room temperature curing, vacuum compatible epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This epoxy system offers excellent adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1452 HT-2LO is capable of passing NASA low outgassing test (ASTM E-595). It offers an extensive service temperature range of -50°C to +230°C. This adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is castable up to 3 inches depth. It offers excellent chemical resistance to a variety of fuels, oils and water. It is amber clear in color. KB 1452 HT-2LO is widely used in aerospace, optical, electro-optical, electronics and specialty OEM applications, where high vacuum compatibility is crucial even at elevated temperatures. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |