Product Highlights:- Outstanding optical clarity
- First-rate toughness
- Excellent flow properties
- Tremendous mechanical strength properties
- Exceptional electrical insulator
- Long working life
Kohesi Bond KB 10230 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a 100:32 (Part A: Part B) mix ratio by weight. The highlight of this product is its superior optical clarity and its long working life at room temperature. This product offers very good flow properties, allowing it to be applied in extremely thin layers. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 10230 offers superior impact resistance. It offers a service temperature range of -65°C to +150°C. It offers outstanding physical strength properties. KB 10230 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and dimensional stability. This product’s low exotherm, light transmission capability and strength makes it ideal for use in aerospace, electronics, optical, fiber-optic and various OEM applications. Typical Applications: - Bonding
- Sealing
- Coating
- Encapsulation
- Potting
Information provided by Kohesi Bond Custom Engineered Adhesives |
