Product Highlights:- Superior optical clarity
- Excellent flow properties
- Outstanding adhesion to plastics
- Bonds without crazing or stress cracking
- Exceptional electrical insulation properties
- Stellar dimensional stability
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent adhesion to plastics like polycarbonates and acrylics among others without any stress cracking. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1040 P is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.55. It offers an extensive service temperature range of -50°C to +120°C. This adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure. KB 1040 P adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of fuels, oils and water. Part A and Part B are clear in color. KB 1040 P is widely used in optical, optoelectronic, fiber-optic, electronics, aerospace and related industries especially when plastic substrates are being used. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |