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Master Bond adhesives
Kohesi Bond KB 2832 PI One component, high temperature resistant polyimide system for bonding and sealing
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: Product Highlights:
  • Excellent high temperature resistance
  • High Tg of 310°C
  • Stellar mechanical strength and stability
  • Superb electrical insulation properties
  • Resistance to extreme thermal cycling
  • Unlimited working life at room temperature
Kohesi Bond KB 2832 PI is a specialty, single component polyimide system that offers high temperature resistance. It offers a glass transition temperature of 310°C and can easily withstand temperatures above +450°C. It cures in merely 2 hours at 180°C. A post cure at 250°C for 4-8 hours is highly recommended for optimal high temperature performance. Being a one component system, it requires no mixing and offers an unlimited working life at room temperature. It offers ease of application KB 2832 PI can withstand severe thermal cycling and shocks. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides first-rate bonding and physical strength properties, as well as dimensional stability. It offers a startling tensile strength of over 13,600 psi. KB 2832 PI is safe to use and it does not contain any solvents or diluents deemed harmful by REACH. In addition to superior electrical insulation properties, it also extends chemical resistance to a variety of solvents, fuels and water. It has an amber brown color. KB 2832 PI is available in 50% and 70% solids content. Owing to its high-caliber performance at high temperatures, KB 2832 PI is widely used in various electronics, optoelectronic, aerospace and specialty OEM applications.

Typical Applications:

  • Bonding
  • Sealing
  • Coating

Information provided by Kohesi Bond Custom Engineered Adhesives

Vendors:
Available Properties
  • Viscosity
  • Hardness, Shore D
  • Tensile Strength
  • Tensile Strength
  • Elongation at Break
  • Tensile Modulus
  • Compressive Strength
  • Peel Strength
  • Volume Resistivity
  • Dielectric Constant
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time, post cure
  • Shelf Life, in original unopened containers
  
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Category Notes
Plastic

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