Product Highlights:- Superior thermal conductivity
- Easy 1:1 mix ratio by weight or volume
- Resistant to temperatures as high as 200°C
- Superior dimensional stability
- Exceptional electrical insulation properties
- Low coefficient of thermal expansion
Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 ANHT being a filled system, offers first-rate dimensional stability and exceptionally low coefficient of thermal expansion. It offers an extensive service temperature range of -50°C to +200°C. It is an adhesive offering preeminent physical strength properties. KB 1631 ANHT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers excellent chemical resistance to a variety of acids, bases, fuels, oils and water. Part A has a light gray color and Part B has a gray color. Owing to its Excellent performance and heat transfer capabilities KB 1631 ANHT is widely used in electronics, aerospace, quality OEM and other similar industries. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
