Honeywell PTM3180, a highly thermally conductive Phase Change Material (PCM) in both pad and dispense formats, is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. Based on a polymer PCM system, this material exhibits excellent wetting at interfaces during typical operating temperature ranges, resulting in very low surface contact resistance. A proprietary filler material provides high thermal conductivity (4.4 W/m·K) and low thermal impedance (<0.16°C cm2/W @ 2 mil), making PTM3180 desirable for high performance integrated circuit devices. Benefits: - High performance filler and polymer technology
- Phase change at 45°C
- Highly conductive filler with tailored loading to optimize performance
- Superior handling and reworkability
- Reliable thermal performance
Features: - Key outputs in thermal impedance for PTM3180 have been measured to fit individual needs.
Applications: Clamping pressure and temperature are suggested to achieve a minimum bond line thickness of the thermal interface material, typically less than 1.5 mil (0.038 mm) for best performance. The material must go through the phase change temperature in order to exhibit entitlement performance. Roll Format Tape: - Plastic liner
- 10 mil (0.25 mm) thickness supplied
Information provided by Honeywell |