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Metal adhesives
Henkel Loctite® ABLESTIK CDF 600 Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver film

Cure: Heat cure

Product Benefits:

  • Low warpage
  • Thermally conductive
  • Electrically conductive
  • High MSL reliability
  • Controlled fillet size
  • No resin bleed-out
  • Consistent bondline control with minimal die tilt
  • Pre-cut wafer lamination equipment compatible
  • Recommended for thin wafer handling applications
  • Good wetting and low warpage for large die
Application: Die attach

Typical Package Application: PBGA, FBGA, CSP

LOCTITE ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.

Information provided by Loctite®

Available Properties
  • Filler Content, Uncured
  • Tensile Modulus
  • Tensile Modulus
  • Volume Resistivity, Bulk
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity, ASTM E1461, Bulk
  • Glass Transition Temp, Tg
  • Cure Time, ramp to 100°C + 30 minutes @ 100°C + 30 minute ramp to 175°C + 1 hour @ 175°C
  • Shelf Life, Uncured, Work life
  • Shelf Life, Uncured
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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Metal adhesives
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