Cure: Heat cure
Product Benefits:
Typical Package Application: CSP, BGA and Flip Chip BGA
LOCTITE ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large volume cartridges (up to 20 oz). It is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products. LOCTITE ECCOBOND E 1216M passes NASA outgassing standards.
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Category NotesPlastic