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Master Bond adhesives
Henkel Loctite® ECCOBOND E 1216M Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat cure

Product Benefits:

  • Snap curable
  • Fast, void-free underfill of area array devices
  • Excellent stability during shipping, storage and use
  • Excellent adhesion and strength
  • Non-anhydride curing chemistry
  • Passes NASA outgassing
Application: Underfill

Typical Package Application: CSP, BGA and Flip Chip BGA

LOCTITE ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large volume cartridges (up to 20 oz). It is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products. LOCTITE ECCOBOND E 1216M passes NASA outgassing standards.

Information provided by Loctite®

Available Properties
  • Specific Gravity
  • Brookfield Viscosity, Spindle 4, speed 20 rpm
  • Hardness, Shore D, Sample cured 5 minutes @ 160ºC
  • Flexural Modulus, Cured
  • Flexural Modulus, Cured
  • Flexural Modulus, Cured
  • Flexural Modulus, Cured
  • Flexural Modulus, Cured
  • Flexural Modulus, Cured
  • Volume Resistivity
  • Surface Resistance
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity, Cured, Laser Flash
  • Glass Transition Temp, Tg, Cured, by TMA
  • Cure Time, Snap or Inline Cure
  • Cure Time, Fast Cure
  • Cure Time, Fast Cure
  • Working Life, Worklife, 50% increase in viscosity
  • Shelf Life
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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