| GeleaseTM MG-121 exhibits the lowest thermal resistance of all thermal interface materials currently available from Lord. It is a one-component thermally conductive gel. This GeleaseTM formulation achieves thicknesses of 1-2 mils in order to minimize the thermal pathway and maximize heat flow. Gelease™ MG-121 provides extremely efficient heat transfer from Flip Chip devices (including microprocessors), PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The crosslinked structure of GeleaseTM MG-121 inhibits bleed, separation, and pump-out that are typically observed in many thermal interface materials.All information provided by Lord. |
