Arlon Electronic Materials 85NT Polyimide Nonwoven Aramid Laminate and Prepreg

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Arlon Electronic Materials 85NT Polyimide Nonwoven Aramid Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	85NT is a pure polyimide laminate and prepreg system (Tg = 250°C), reinforced with a non-woven aramid substrate. This system combines the high-reliability features of polyimide (improved PTH reliability and temperature stability) with the low in-plane () expansion and outstanding dimensional stability of a non-woven aramid reinforcement. Low in-plane expansion of 6-9 ppm/°C allows attachment of SMT devices with minimal risk of solder failure joint failure due to CTE mismatch Nonwoven aramid reinforcement provides outstanding dimensional stability and enhanced registration for improved multilayer yields High Decomposition temperature offering outstanding high-temperature lifetime performance Polymeric reinforcement results in PCBs typically 25% lighter in weight than conventional glass-reinforced laminates Laser and plasma ablatable for high speed formations of microvias and other features as small as 25 microns Electrical and mechanical properties meeting the requirements of IPC-4101/53 Compatible with lead-free soldering RoHS/WEEE compliant Typical Applications: Military and commercial avionics, missiles and missile defense, satellites, and other high-reliability SMT applications requiring both low in-plane () CTE values PCBs that are subjected to high temperatures during processing, such as lead-free soldering Applications with significant lifetimes at elevated temperatures, such as aircraft engine instrumentations, on-engine applications, or industrial sensors Information provided by ARLON Electronic Materials.
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Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Tensile Strength, IPC TM-650 2.4.18.3
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.3, may vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.3.41, Initial
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent

Property Data

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Category Notes
Plastic

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