Product Highlights:- Very high thermal conductivity
- Low coefficient of thermal expansion
- Castable up to 3 inches depth and more
- Outstanding chemical resistance
- Exceptional electrical insulation properties
- Very good flowability
Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. It offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. Rapid cures are achievable with a straight heat cure as well at elevated temperatures. KB 1452 HT-2AO offers an extensive service temperature range of -70°C to +200°C. It offers outstanding physical strength properties and dimensional stability. KB 1452 HT-2AO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of organic and inorganic acids, solvents, alkalis, aromatic hydrocarbons, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its high thermal conductivity and very low CTE, KB 1452 HT-2AO is widely used in medical, electronics, aerospace, optical, semiconductor and various OEM applications requiring effective heat transfer capabilities. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
