Product Highlights:- Excellent die shear strength
- Ultimate dispensing profile
- Thermally conductive
- Low ionic content (chlorine < 15 ppm)
- Capable of passing NASA low outgassing
- Unlimited working life at room temperature
Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room temperature. It cures exceptionally fast in 5 - 10 minutes at 150°C. TUF 1613 HT-DA dispenses ideally leaving no tail behind and can be easily used with automated dispensing equipment. It offers an extensive service temperature range of -70°C to +200°C. It adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding die shear strength and is capable of passing NASA low outgassing test specifications. TUF 1613 HT-DA offers phenomenal thermal conductivity of 1.4 - 1.5 W/m/K. It has the capability to withstand arduous thermal cycling. In addition to superior electrical insulation, TUF 1613 HT-DA also offers less than 1% weight change after rigorous 168 hours of 85°C/85% RH test. It has a standard light yellow - tan color. This perfect combination of Excellent performance, ease of use, incomparable die shear strength and dimensional stability makes TUF 1613 HT-DA a guru for die attach applications. Typical Applications: - Bonding
- Sealing
- Die Attach
Information provided by Kohesi Bond Custom Engineered Adhesives |
