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Polymer Distribution
Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material
Categories: Polymer; Thermoplastic

Material Notes: XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8100 circuit materials are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies.
XT/duroid 8100 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C. The XT/duroid products possess impressive chemical and radiation resistance.

Features and Benefits:

  • Stable dielectric constant and dissipation factor over a wide frequency range - High reliability and uniform electrical properties over frequency
  • High maximum operating temperature - suitable for applications where high temperature stability is required
  • Excellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environments
  • Environmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity
  • 1/2 oz. very low profile electrodeposited copper foil cladding

Typical Applications:

  • Flex-to-install applications
  • Lightweight feed manifolds
  • Semiconductor burn-in
  • Conformal circuitry
  • Oil and gas exploration

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Moisture Absorption at Equilibrium, IPC-TM-650 2.6.2.1, D24/23
  • Moisture Absorption at Equilibrium, ASTM D570, D48/50
  • Thickness
  • Tensile Strength, ASTM D638, RT
  • Tensile Modulus, ASTM D638, RT
  • Peel Strength, IPC-TM-650 2.4.8, Copper
  • Volume Resistivity, IPC 2.5.17.1, Condition A; Z direction
  • Surface Resistance, IPC 2.5.17.1, Condition A; X, Y direction
  • Dielectric Constant, IPC-TM-650 2.5.5.5.1, Z direction
  • Dielectric Constant, Differential Phase Length Method, Z direction
  • Dielectric Strength, IPC-TM-650 2.5.6.2, Z Direction
  • Dissipation Factor, IPC-TM-650 2.5.5.5.1, Z direction
  • CTE, linear, IPC-TM-650 2.1.41, X-Direction
  • CTE, linear, IPC-TM-650 2.1.41, Y-Direction
  • CTE, linear, IPC-TM-650 2.1.41, Z-Direction
  • Thermal Conductivity, ASTM C518
  • Maximum Service Temperature, Air, pending UL RTI
  • Glass Transition Temp, Tg, ASTM D3850, TMA
  • Flammability, UL94, pending
  
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Category Notes
Plastic

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