Product Highlights:- Superb thermal conductivity
- Very cost effective
- Good flow properties
- Resists more than 815°C
- Effective moisture barrier
- Capable of passing NASA low outgassing
Kohesi Bond KB-SS-AO is a ceramic filled, inorganic, aqueous sodium silicate based system for bonding and coating. This product offers very good high temperature resistance. KB-SS-AO has a wide service temperature range of -18°C to +815°C. This product can be easily applied with a brush or a spraying system. It can cure at room temperature in 1-2 days or it can be heat cured at 80°C for 1-2 hours. It is recommended to cure the product at 90°C for 30 minutes followed by an additional cure at 150°C for 30 minutes. To avoid the system from causing “blistering”, special care should be taken to slowly ramp the curing temperature over a 15-30 minute span. KB-SS-AO offers outstanding thermal conductivity (> 1.6 W/m/K). This inorganic system is non-toxic, non-flammable and odorless. This product has the ability to attain most of its strength and temperature resistance properties at 70%-90% of full cure. At this point, the adhesive can be removed by exposing it to boiling water for a few hours. However, KB-SS-AO can fully withstand boiling water upon achieving a full cure. It offers very good flow properties, dimensional stability and excellent electrical insulation properties. It can adhere to a wide variety of substrates, such as metals, ceramics, composites and many plastics. KB-SS-AO is a specialized system formulated for use in aerospace, electronics, optical and specialty OEM applications requiring high temperature resistance, thermal conductivity and good electrical insulation properties. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
