Description: HexBond™ ST1035 adhesive film is a 120oC/248oF cure modified epoxy film supported (moisture-resistant polyester carrier) or unsupported. Standard areal weights are 150, 250 and 300 g/m2. 75, 100, 200, 400 and 450 g/m2 films are also available on demand. Designed for the manufacture of sandwich structures from a various types of skins and cores and for bonding a wide range of substrates (metals, plastics, reinforced plastics and composite structures, marble, etc.). Features: - Excellent balance between peel and shear in the range of -55oC/67oF to 120oC/248oF
- Very flexible cure temperature from 90oC/194oF to 160oC/320oF and processing methods (press, oven or autoclave)
- Good tack for easy adhesive joint assembly
Applications: - Sandwich construction
- Metal-to-metal bonding
- Composite-to-composite bonding
- Metal-to-composite bonding
Information provided by Hexcel Corporation. |