- Excellent for Copper and difficult-to-solder metals including Alloy 42, Alloy 51, and Nickel alloys
- Effective on bare Copper, OSP, HASL, or plated surfaces
- May be applied in either foam or spray systems
- Solders single- and double-sided circuit boards
- Conforms to IPC ANSI J-STD-004, Type ORM1.
Description: Superior No. 80 is a high activity halide, Neutral organic acid (OA) foam flux formulated for difficult-to-solder surfaces where activated rosin fluxes and less active OA fluxes cannot be used. This flux combines a unique activation system with a special no-polyol base that is compatible with all solder masks, does not leave a post-solder white residue, and is an ideal choice for high volume soldering operations. The solderability and cleanability of Superior No. 80, along with excellent foaming characteristics and heat stability, provide a moderately low “solids” flux adaptable to a wide variety of board styles, sizes and thicknesses.Applications: WAVE SOLDERING-To ensure optimum flux activity, a topside temperature of 88-116°C/190-240°F is recommended. Residues from Superior No. 80 are completely water-soluble and can be removed in batch or in-line aqueous cleaning systems. For best cleaning results, wash residues immediately after soldering. A water temperature of 49-60°C/120-140°F is recommended for optimum results. However, excellent results are routinely achieved at lower water temperatures. The organic base of Superior No. 80 is non-toxic and low foaming. Rinse waters are completely biodegradable. Consult local authorities for disposal regulations. Information provided by Superior Flux |
