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Metal adhesives
Resinlab® EP1330 Heat Cure Epoxy Polymer System
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application, or general polymer systems where the application requires high thermal conductivity, low shrinkage, low CTE and excellent adhesion to a wide variety of plastics, metals and circuit board materials. EP1330 is a thixotropic adhesive with slight sag upon curing, EP1330LV is a semi-free flowing material which will self level, but still maintain a conformal build on circuit board components.

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Vendors:
Available Properties
  • Specific Gravity, TM R050-16
  • Water Absorption, TM R050-35
  • Viscosity, Mixed
  • Hardness, Shore D
  • Tensile Strength at Break, TM R050-36
  • Tensile Strength, Ultimate, TM R050-36
  • Tensile Strength, Yield, TM R050-36
  • Elongation at Break, TM R050-36
  • Tensile Modulus, TM R050-36
  • Compressive Yield Strength, TM R050-38
  • Compressive Strength, TM R050-38, Break
  • Compressive Strength, TM R050-38, Ultimate
  • Compressive Modulus, TM R050-38
  • Adhesive Bond Strength, Lap Shear-Aluminum
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg
  • Cure Time
  • Cure Time
  • Cure Time
  
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Category Notes
Plastic

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Metal adhesives
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