Henkel Loctite® ECCOBOND FP4802 Epoxy

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Henkel Loctite® ECCOBOND FP4802 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance Black Cure Heat cure Application Encapsulating LOCTITE ECCOBOND FP4802 is a high purity, liquid encapsulant designed for use in applications utilizing lead-free solder. This product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C. LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC) Information provided by Loctite®
Vendors:

Available Properties

Specific Gravity
Filler Content
Brookfield Viscosity, Spindle 7, speed 10 rpm
Flexural Strength, ASTM D790, Cured
Flexural Modulus, ASTM D790, Cured
CTE, linear, Cured, alpha1
CTE, linear, Cured, alpha2
Maximum Service Temperature, Air
Glass Transition Temp, Tg, Cured
Cure Time, plus 90minutes @ 165°C, Alternative Cure Schedule
Cure Time, plus 120minutes @ 165°C
Gel Time
Shelf Life, from date of manufacture

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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