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Arlon Electronic Materials 37N Polyimide Low-Flow
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: 37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

  • Tg > 200°C and expansion characteristics typical of polyimide greatly improves PTH reliability
  • Good bond strength to Kapton® polyimide, copper and other metals
  • Curable at temperatures as low as 350°F
  • Excellent thermal stability
  • Available in different flow ranges and fiberglass styles for optimal process flexibility
  • Electrical and mechanical properties meeting the requirements of IPC-4101/42
  • Compatible with lead-free solder processing
  • RoHS/WEEE compliant

Typical Applications:

  • Bonding multilayer polyimide rigid-flex
  • Attaching heat sinks to polyimide MLBs
  • Other applications where minimal and uniform resin flow is required

    Information provided by ARLON Electronic Materials.

  • Vendors:
    Available Properties
    • Water Absorption, IPC TM-650
    • Tensile Strength, IPC TM-650
    • Flexural Strength, IPC TM-650 2.4.4
    • Poissons Ratio, ASTM D3039
    • Peel Strength, To Kapton, as received
    • Peel Strength, IPC TM-650, To Copper (1 oz./35 micron); At Elevated Temperatures
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
    • Volume Resistivity, IPC TM-650, E24/125
    • Volume Resistivity, IPC TM-650, C96/35/90
    • Surface Resistance, IPC TM-650, C96/35/90
    • Surface Resistance, IPC TM-650, E24/125
    • Dielectric Constant, IPC TM-650, may vary with resin %
    • Dielectric Strength, IPC TM-650
    • Dissipation Factor, IPC TM-650
    • Arc Resistance, IPC TM-650 2.5.1
    • CTE, linear
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
    • Thermal Conductivity, ASTM E1461
    • Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
    • Decomposition Temperature, IPC TM-650 2.3.41, Onset
    • Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
    • Flammability, UL94
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